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Hong Kong Prepares for Tender of RMB 1.5 Billion Government Bonds

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By Aggregated - see source on May 7, 2025 Blockchain
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Lawrence Jengar
May 07, 2025 04:55

The Hong Kong Monetary Authority announces a tender for RMB 1.5 billion in 2-year government bonds, scheduled for May 13, 2025, as part of the Infrastructure Bond Programme.





The Hong Kong Monetary Authority (HKMA) has announced a tender for RMB 1.5 billion worth of 2-year Institutional Government Bonds, slated for May 13, 2025. These bonds are part of the Infrastructure Bond Programme, an initiative by the Hong Kong Special Administrative Region Government (HKSAR) to bolster infrastructure development, according to the Hong Kong Monetary Authority.

Tender Details and Participation

The bonds, maturing on May 17, 2027, will offer an annual interest rate of 1.71%, payable semi-annually. The tender process, exclusive to Primary Dealers appointed under the Infrastructure Bond Programme, will take place from 9:30 am to 10:30 am on the designated date. Potential investors must apply through these Primary Dealers, with each bid required to be in multiples of RMB 50,000.

Publication of Results

Results of the tender will be disclosed on the HKMA’s website and other financial platforms such as Bloomberg and Refinitiv, with a publication deadline set for no later than 3:00 pm on the tender day.

Infrastructure Focus

The proceeds from this bond issuance will be directed toward infrastructure projects, aligning with the objectives outlined in the Infrastructure Bond Framework available on the Hong Kong Government Bonds website. This move is part of Hong Kong’s broader strategy to enhance its infrastructure capabilities and support sustainable development.

Additional Context

This tender comes amid heightened interest in sustainable finance and infrastructure investment in Asia. As global demand for infrastructure grows, Hong Kong’s initiative reflects a strategic effort to maintain its position as a leading financial hub while addressing local development needs.

The bonds are expected to commence trading on the Stock Exchange of Hong Kong Limited on May 16, 2025, further integrating these financial instruments into the market and providing additional liquidity options for investors.

Image source: Shutterstock


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